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Bond University 2021 Vynka Hohnen Scholarships in Australia

Bond University - Vynka Hohnen Scholarships in Australia 2021 is offered for Bachelors degree in the field of Subjects offered by the University. The deadline for the sending your application is 01 Aug 2021. This scholarship is provided by Bond University and the value of this scholarship is Only tuition fees, 100% tuition fees . This scholarship is open for: Open to Australian nationals.
Vynka Hohnen Scholarship is offered by Bond University to support bachelor applicants.

About Bond University

The Bond University is a private not-for-profit university located in Robina, Gold Coast, Queensland, Australia. The University was established at the initiative of Alan Bond, the founder and Chairman of Bond Corporation and Harunori Takahashi, President of EIE International. The University's development was funded via a joint venture between Bond Corporation in Australia and the Japanese entity, EIE International. In 1987, the Parliament of Queensland granted Bond University university status via the passage of the Bond University Act. The University commenced teaching in May 1989 with... continue reading

Bond University


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Bond University Bachelors

Application Deadline01 Aug 2021
Country to studyAustralia
School to studyBond University
TypeUndergraduate
SponsorBond University
GenderMen and Women

Aim and Benefits of Bond University Bachelors

  • The successful applicants of Bond University - Vynka Hohnen Scholarships in Australia, 2021 will receive 100% tuition fees for any single undergraduate degree excluding the Bond Medical Program.

Requirements for Bond University Bachelors Qualification

  • Vynka Hohnen Scholarship is open to a Year 12 school leaver from a Western Australian Secondary School.
  • To be considered, applicants must be predicted to achieve a minimum of ATAR 96.00 or IB Diploma 38.
  • Applicants who are actively involved in extracurricular activities are preferred for the scholarship.
  • Must exhibit effective leadership skills.
  • Candidates with excellent sociable skills and who is generous is a plus.
  • Applicants are required to submit a 500-word essay.

Application Deadline

August 1, 2021


How to Apply

Interested and qualified? Go to Bond University on student-bond.studylink.com to apply

Upon completion of the Bond University Study Application Form, eligible students can apply for scholarships via the Bond University Scholarship Application Form. Simply use the same log-in details as used for your study application and enter 'scholarship' in the keyword field on the Start an Application tab. 

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