Bond University 2025 Vynka Hohnen Scholarship for Udergraduate Students

Our prestigious Vynka Hohnen Scholarship is awarded annually to a Year 12 student enrolled at a Western Australian secondary school.  

It is designed to acknowledge young achievers who demonstrate leadership and community involvement, a capacity for academic achievement and a generous and outgoing nature. 

• Table of Content
• About Bond University
• Vynka Hohnen Scholarship
• Aim and Benefits of Vynka Hohnen Scholarship
• Requirements for Vynka Hohnen Scholarship Qualification
• Application Deadline
• How to Apply

About Bond University

The Bond University is a private not-for-profit university located in Robina, Gold Coast, Queensland, Australia. The University was established at the initiative of Alan Bond, the founder and Chairman of Bond Corporation and Harunori Takahashi, President of EIE International. The University's development was funded via a joint venture between Bond Corporation in Australia and the Japanese entity, EIE International. In 1987, the Parliament of Queensland granted Bond University university status via the passage of the Bond University Act. The University commenced teaching in May 1989 with... continue reading

Vynka Hohnen Scholarship

Application Deadline	31 Jul 2025
Country to study	Australia
School to study	Bond University
Type	Undergraduate
Sponsor	Bond University
Gender	Men and Women

Aim and Benefits of Vynka Hohnen Scholarship

As a Vynka Hohnen Scholar, you will be provided with 100 per cent tuition remission for any single undergraduate degree (excluding the Bond Medical Program and Diploma entry students), and be expected to start in the January semester of the year following completion of Year 12.

Requirements for Vynka Hohnen Scholarship Qualification

To be eligible to apply for this scholarship, you must:

• Be a domestic student completing Year 12 at a Western Australian secondary school.
• Be predicted to achieve a minimum of?ATAR?95.00 or IB Diploma 38.
• Hold a demonstrated record of leadership, initiative, and service to your school and/or community.  
• Be prepared to maintain the level of academic and personal excellence that distinguished you as an applicant once you have commenced at Bond. 

Application Deadline

July 31, 2025

How to Apply

Interested and qualified? Go to Bond University on student-bond.studylink.com to apply

1. Complete the?Bond University Study Application Form to lodge your application for your chosen program. Learn more about this process.
2. Complete the?Bond University?Scholarship Application Form. Simply use the same log-in details as used for your study application and enter 'scholarship' in the keyword field on the 'Start an Application' tab.?

You must complete and submit your scholarship application before the application closing date as no late scholarship applications will be considered! 

For more details, visit Bond University Scholarship webpage