Bond University Australia 2021 International Stand Out Scholarship

International Stand Out Scholarship, 2021 is offered for Bachelors, Masters degree in the field of Eligible courses offered. . The deadline for the sending your application is 11 Jun 2021. This scholarship is provided by Bond University and the value of this scholarship is Partial Funding, 25% tuition fee . This scholarship is open for: Only eligible countries.
Bond University offers "stand out" students who are applying to study at an undergraduate or postgraduate level, with tuition remission scholarships. International Stand Out Scholarships are awarded on the basis of academic merit and are a testament to Bond University’s commitment to quality international students.

• Table of Content
• About Bond University
• Bond University Bachelors
• Aim and Benefits of Bond University Bachelors
• Requirements for Bond University Bachelors Qualification
• Application Deadline
• Bond University Masters Scholarship
• Aim and Benefits of Bond University Masters Scholarship
• Requirements for Bond University Masters Scholarship Qualification
• Application Deadline
• How to Apply

• Bachelors
• Masters

Bond University Bachelors

Application Deadline	11 Jun 2021
Country to study	Australia
School to study	Bond University
Type	Undergraduate
Sponsor	Bond University
Gender	Men and Women

Aim and Benefits of Bond University Bachelors

Successful applicants of the International Stand Out Scholarship are awarded up to 25% tuition remission for their chosen program.

Requirements for Bond University Bachelors Qualification

• The scholarship is provided to only eligible country applicants. 
• Applicants must have achieved a minimum academic result of ATAR 89.00 or IB Diploma 32 (or equivalent) for undergraduate applicants or achieved ‘stand out’ academic results from undergraduate studies for postgraduate applicants.
• Evidence of your leadership, initiative, and service to your school/university and/or community. 
• Applicants must not have already commenced undergraduate or postgraduate studies at Bond University.
• Applicants studying English at Bond University College as part of a packaged Offer are still eligible to apply.

Note:

The following programs are not eligible for consideration for the scholarships – Master of Psychology (Clinical), Master of Professional Psychology, Study Abroad and Exchange Programs, the Bond Medical Program, and Doctor of Physiotherapy

Application Deadline

June 11, 2021

Interested in this scholarship; Go down to apply

Bond University Masters Scholarship

Application Deadline	11 Jun 2021
Country to study	Australia
School to study	Bond University
Type	Masters
Sponsor	Bond University
Gender	Men and Women

Aim and Benefits of Bond University Masters Scholarship

Successful applicants of the International Stand Out Scholarship are awarded up to 25% tuition remission for their chosen program.

Requirements for Bond University Masters Scholarship Qualification

• The scholarship is provided to only eligible country applicants. 
• Applicants must have achieved a minimum academic result of ATAR 89.00 or IB Diploma 32 (or equivalent) for undergraduate applicants or achieved ‘stand out’ academic results from undergraduate studies for postgraduate applicants.
• Evidence of your leadership, initiative, and service to your school/university and/or community. 
• Applicants must not have already commenced undergraduate or postgraduate studies at Bond University.
• Applicants studying English at Bond University College as part of a packaged Offer are still eligible to apply.

Note:

The following programs are not eligible for consideration for the scholarships – Master of Psychology (Clinical), Master of Professional Psychology, Study Abroad and Exchange Programs, the Bond Medical Program, and Doctor of Physiotherapy.

Application Deadline

June 11, 2021

How to Apply

Interested and qualified? Go to Bond University on student-bond.studylink.com to apply

Students must submit the Bond University Online Application Form before applying for this scholarship.