MACC Undergraduate Excellence Scholarship 2025

In partnership with The Malaysian Australian Alumni Council, Bond University offers high academic achievers from Malaysia, who are applying to study at an undergraduate level for a bachelor's degree, with part-fee tuition remission scholarships.

Bond University - MACC* Undergraduate Excellence Scholarships are awarded on the basis of academic excellence and are a testament to Bond University’s commitment to quality and outstanding international students.

• Table of Content
• About Bond University
• MACC Undergraduate Excellence Scholarship
• Aim and Benefits of MACC Undergraduate Excellence Scholarship
• Requirements for MACC Undergraduate Excellence Scholarship Qualification
• Application Deadline
• How to Apply

MACC Undergraduate Excellence Scholarship

Aim and Benefits of MACC Undergraduate Excellence Scholarship

As a MACC Undergraduate Excellence Scholar, you will be awarded up to 50% tuition remission for any single undergraduate bachelor’s degree (excluding the Bond Medical Program) and will commence your study in either the May or September semester.

Requirements for MACC Undergraduate Excellence Scholarship Qualification

To be eligible to apply for this scholarship, you must:

• Be a citizen of Malaysia
• Have achieved at least 6.5 overall and a minimum of 6.0 in each sub-band of the IELT's or equivalent test
• Have achieved academic excellence in the top percentile from your high school qualification (for example, IB Diploma score of 38 or higher, minimum ATAR of 96) or equivalent
• Not have already commenced undergraduate studies at Bond University

Application Deadline

How to Apply

Applications for this scholarship are made directly with the Malaysian Australian Alumni Council.

Applicants must complete the Bond University MACC Scholarship Application Form (Word document). Once complete, you must submit it along with supporting documents to MAAC for consideration.

You must complete and submit your scholarship application before the application closing date as no late scholarship applications will be considered.

For more details, visit Bond University scholarship webpage